The table below list industry and military specifications for plating finishes that are available from Cybershield.
|Electroless Copper Plating||MIL-P-47266|
|Electroless Nickel Plating||MIL-C-26074||ASTM B733||AMS 2404|
|Electrolytic Copper Plating||MIL-C-14550||ASTM B734||AMS 2418|
|Electrolytic Nickel Plating||QQ-N-290||ASTM B689||AMS 2403|
|Electrolytic Chrome (Bright or Satin) Plating||QQ-C-320||ASTM B456||AMS 2406|
|Electrolytic Tin||MIL-T-10727||ASTM B545||AMS 2408|
Download the Cybershield Brochure to obtain more information about metallized plastics and other manufacturing services offered by us.
ASTM Standard for Electroless Plating Plastic for EMI Shielding
The table below provides ASTM B904 standard for electroless nickel over electroless copper deposited onto plastic components for EMI shielding.
|Type||Copper Thickness (min)||Nickel Thickness (min)||Shielding Effectiveness||Application|
|1||40 micro-inches (1.0 µm)||10 micro-inches (0.25 µm)||80-100 dB||FCC Class B|
|2||40 micro-inches (1.0 µm)||60 micro-inches (1.5 µm)||80-100 dB||Harsh Conditions|
|3||100 micro-inches (2.5 µm)||10 micro-inches (0.25 µm)||90-100 dB||MIL-STD-461|
|4||Optional/Not Required||40 micro-inches (1.0 µm)||50-70 dB||FCC Class A|
Electroless nickel plating plastic is either Grade 1 with phosphorous content of 3%-5%. Grade 2 electroless nickel plating plastic will contain 6-11% phosphorous content. Electroless nickel plating with low phosporous content exhibit low contact impedance. Electroless nickel plating with higher phospohorous content will have somewhat higher contact impedance but will have improved corrosion reistance.
Cybershield applies mid-phos electroless nickel with 5-8% phosphorous content.
Contact Cybershield for more information about plating specifications or to discuss your requirements.