Besides offering services for all-over, selective, chrome, and decorative plating on plastic, conductive gaskets, metallized plastic services, ESD coatings, EMI RFI shielding, 3D circuit board technology services, conductive paint coating services, Cybershield offers automated sub-assembly and supply chain management services. We have established relationships with world-class molders who specialize in hard-wall, thin-wall and foamed materials.
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Automated
Heat Staking Inserts |
Precision
Hole Tapping |
We offer you a variety of secondary operations such as
- Gasket application (conductive, dispensed, foam-over-fabric, environmental
- Inserting Hardware (heat staking and ultrasonic insertion)
- Decorative paint
- Pad printing & part marking with Inkjet printer
- Precise hole tapping
- Sonic welding
- Mechanical assembly and electrical testing of your product
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Telecom
Faceplate Assembly - Plate, Decorative Paint, Ultrasonic
Pin Insertion, and Assemble Latches |
Router
Chassis - Plate, Ultrasonic Hardware Insertion, Assemble
Chassis Components, Decorative Paint |
As
your turn-key provider, we offer:
- Application support to assist our customer in designing a cost effective system that meets the OEM requirement
- Total program responsibility including supply chain management
- Pro E/Unigraphics Solid Model Design/Design Support
- Gerber Data Compatible for Circuit Lay-Out
- Rapid Prototype Design and Procurement using SLA models, machined, soft tooled, or cast parts to allow customer to validate the design and performance of the metallized plastic system
- Production fixturing design and Procurement
- Competitive molding solutions
Cybershield can become your single source supplier. If you are interested in capturing the ultimate efficiencies for your project or customer, please contact us to learn more information on our metallized plastics, ESD coatings, EMI RFI shielding, 3D circuit board technology, conductive paint coating services as well as selective, chrome, and decorative plating for plastic and conductive gasket materials. |